In May 2012, our company began to develop a double-sided scrubber. Early wet cleaning not only can not remove the submicron particles on the surface of semiconductor wafer, but also has serious damage to the surface of the wafer. And the double-sided scrubber is very effective to remove submicron particles, and does not destroy the silicon wafer surface, the cleaning effect is the best. The company has successfully developed the equipment in December 2012 and successfully put into the cleaning market.