The principle of semiconductor cleaning machine is mainly through the transducer, then the sound energy of the power ultrasonic frequency source is converted into mechanical vibration, and the ultrasonic wave is radiated into the cleaning liquid in the slot by cleaning the wall of the tank. Because of the ultrasonic radiation, the microbubbles in the liquid in the tank can keep the vibration under the action of sound wave.
An ultrasonic wave propagating in a liquid can clean the dirt on the surface of an object. Its principle can be explained by the phenomenon of "cavitation ": when the sound pressure transmitted by ultrasonic vibration in a liquid reaches an atmospheric pressure, its power density is 0.35 w/cm2, then the peak sound pressure of ultrasonic wave can reach vacuum or negative pressure, but in fact there is no negative pressure, so a large force will be produced in the liquid, and then the liquid molecule will be pulled into a hollow hollow hollow nucleus. At this point, the cavity will be very close to the vacuum, it will break when the ultrasonic pressure is reversed will reach the limit, the strong impact caused by the rupture and then impact the dirt on the surface of the object. This shock wave phenomenon caused by the rupture of countless tiny cavitation bubbles is called "cavitation" phenomenon.